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Joinset’s Thermal Interface Materials are high-functional composite materials containing polymer and thermally conductive fillers such as aluminum oxide, boron nitride, aluminum nitride, metal and carbon.
Thermal conductive Gap Fillers composed of various materials is provides an effective thermal interface between heat sink and electronic devices where uneven and rough surface textures, air gap are present.
Gap Fillers [Sheet]
Thermal Pad (Z-axis) : It is a soft Silicone sheet having good thermal conductivity. It has one or both side(s) tacky, and is useful for wide gap between heat source and cool source.
Thermal Tape (Z-axis) : It is a soft Acrylic Pressure Sensitive Adhesive (PSA) tape having good thermal conductivity. It has one or both side(s) tacky, and is useful for thin gap between heat source and cool source.
Heat Spreader Sheet (X-Y plane) : It is a flexible composition polymer with or without thin Graphite sheet having good heat spreading. PSA will be adhered on one or both side(s) of it. It is useful for thin gap between heat source and cool source.
Dispensable Gap Fillers [Liquid]
Thermal Gel & Grease (Z-axis) : It is a fluidal Silicone Gel or Grease having good thermal conductivity. User don’t need any curing process after application of it. It is useful for thin gap between heat source and cool source.
Thermal Paste (Z-axis) : It is a fluidal Silicone paste having good thermal conductivity. User need heat curing process after application of it. It is useful for thin gap between heat source and cool source.
Thermal Adhesive (Z-axis) : It is a fluidal Silicone adhesive having good thermal conductivity. User need heat or moisture curing process after application of it. Then, it is hardened and acts as a Thermal Bond. It adheres heat source and cool source.